Review: Embedded Vision System on Module (SoM)

1. FLIR, Boson

FLIR, BOSON

• First, it processes raw imaging data from the thermal imaging core, according to El-Ouazzane. As Pierre Boulanger, Flir’s CTO, pointed out, “In infrared, no two pixels are created equal. We have to process every single pixel at many different levels—way more than a visual sensor.” The highly programmable Myriad 2 “allows us to run those special algorithms,” said Boulanger.
• Second, Myriad 2 in Boson performs advanced computer vision analysis.
• Third, Myriad 2 acts as a system-level SoC for the complete system, noted El-Ouazzane, eliminating “three other subsystems.” Boson users no longer need to add such subsystems as input/output, display drivers to monitor graphics and power, and visual analytics, El-Ouzzane added.

 

센서 기술	비냉각 VOx 마이크로볼로미터
어레이 형식	640 × 512 또는 320×256
픽셀 피치	12 µm
픽셀 피치	장파장 적외선 대역; 7.5µm– 13.5µm
온도분해능	40 mK (산업용); <50 mK (고성능); <60 mK (상용)
풀 프레임 레이트	60 Hz 기준선; 30 Hz 런 타임 선택 가능
슬로 프레임 레이트	9Hz 이하 가능
비균질 수정(NUC)	공장 출하시 교정 필; FLIR의 Silent Shutterless NUC(SSN™)로 FFC 업데이트
태양광선 보호	일체형
연속 줌	지원
심볼 오버레이	매 프레임 별로 다시 쓰기 가능; 반투명 오버레이용 알파 블렌딩(alpha blending)
렌즈 옵션	640 분해능 – 7종 렌즈 옵션 320 분해능 – 8종 렌즈 옵션 자세한 사항은 광학계통 탭 참조
입력 전압	3.3 VDC
전력 소비율	구성에 따라서 최소 500 mW
비디오 채널	CMOS 또는 USB
제어 채널	RS-232 또는 USB
주변기기 채널	I2C, SPI, SDIO
구성가능한 GPIO	최대 11; 사용자 구성 가능
사이즈	렌즈 제외21 × 21 × 11 mm
무게	렌즈 제외 7.5 g (구성에 따라서 차이가 있을 수 있음)
정밀 장착용 나사구멍	4개의 M16x0.35 나사 구멍(후면 커버). 코어보다 무거운 렌즈 사용 시 렌즈 지지대 사용 권장
사용 온도 범위	-40°C ~ 80°C (산업용 및 고성능용 등급)
비사용 시 온도 범위	-50°C ~ 85°C
내충격	1,500 g @ 0.4 msec
사용가능 고도	12 km

 

2. FLIR, Firefly

FLIR, Firefly

• DEEP LEARNING FOR FASTER DEPLOYMENT & NEW POSSIBLITIES
• Quickly develop and deploy accurate solutions to challenging automation problems with deep learning.
• DEEP LEARNING INFERENCE ON-CAMERA

  Reduce system cost and complexity by deploying your trained network to a Firefly DL camera, eliminating the need for a host system for classification tasks

• IDEAL FOR EMBEDDING INTO COMPACT, PORTABLE DEVICES

  Tiny package of 27 mm × 27 mm × 14 mm, only 2W power consumption and 20 gram mass

3. Huaray, Smart camera (Movidius)

Huaray, Smart camera (Movidius)

Technical features：

• Movidius Myraid 2 VPU
• 512MB RAM and 512MB NAND
• Conform to CE,FCC,RoHS certifications
• Software trigger / Hardware trigger / Free run mode
• Embedded algorithm: code-reading
• Ethernet industrial interface,max 100m transmission

Mainly used in barcode reading, product tracing, production control, automatic identification etc.

And also widely used in logistic, 3C, food, vehicle, tobacco, semiconductor etc.

 

4. Huaray, Smart camera (x86)

Huaray, Smart camera (x86)

Technical features：

• Powerful intel platform, easy for secondary development
• 4G memory and 64G SSD internal storage
• Software trigger / Hardware trigger / Free run mode
• Industrial grade M12 connector
• 1Gbps Ethernet industrial interface ,max 100m transmission

Mainly used in barcode reading、product tracing、production control、automatic identification etc.And also widely used in logistic、3C、food、vehicle、tobacco、semiconductor etc.

 

5. ADLINK, NEON-i2000

ADLINK, NEON-i2000

ADLINK’s NEON-i2000 series is an industrial camera family that support Intel® Movidius™ Myriad™ X VPU and a series image sensors that provide users the flexibility to cover many different applications. By supporting multiple deep learning processors, user can deploy the AI camera system with different neural network created by OpenVINO.

 

6. OpenNCC night (122.5 USD)

OpenNCC night 

https://www.aliexpress.com/item/4001119643690.html?spm=a2g0o.productlist.0.0.224b7f93f0hkJb&algo_pvid=901b29a7-e328-40a7-9362-441e4649ed95&algo_expid=901b29a7-e328-40a7-9362-441e4649ed95-3&btsid=0be3769015942815037614875e710f&ws_ab_test=searchweb0_0,searchweb201602_,searchweb201603_

 

 

7. Teledyne, LWIR, SWIR, and Wafer(LWIR)

Explore Calibir GXM LWIR Cameras Teledyne's Latest Uncooled IR Microbolometer Technology with Radiometric Operation	Explore Calibir DXM640 LWIR Cameras Uncooled IR VGA Camera Core	Explore LWIR Microbolometers Wafer-Level-Packaged VOx Microbolometers	Explore Linea SWIR Cameras InGaAs GigE Line Scan Camera

 

8. MISTRAL, Sensor Fusion Kit

MISTRAL, Sensor Fusion Kit

The Sensor Fusion Kit (TDA3 SoC and AWR1443) comprises a processor board, Camera and mmWave RADAR sensor. The Processor Board performs Object Detection, Classification, Identification and Annotates Video stream with RADAR Range data. The Camera and mmWave RADAR sensor board also provides necessary automotive and power interfaces to integrate with the end product environment. mmWave RADAR Module consists of FMCW Transceiver with Integrated PLL, Baseband ADC, R4F controller with accelerator, SPI flash, DSP etc. Camera Sensor Board comes with a CSI based 1.3M CMOS HD image sensor supporting upto 60 fps. The Camera and mmWave RADAR sensor complement each other for object identification, range, velocity and elevation parameters.

The Sensor Fusion Kit includes a starterware and sample applications for common automotive radar/camera usages. It also provides debug interfaces for test and development.
The platform delivers synchronized Point Cloud and Video data. The Point cloud data consisting of object’s ID, Range, Angle, Velocity and Signal strength is delivered over serial/CAN interface. The Video data includes camera stream Annotated with Objects identified, classified and RADAR range over HDMI/Ethernet interface.

The Sensor Fusion Kit is available with three antenna variants to cater to different ADAS applications, Ultra-short Range (ODS), Short Range (Three Elements) and Mid Range (Tapered Elements)

The Sensor Fusion Kit is ideal for applications such as Object Detection, Lane Tracking, Lane Detection and Departure Warning, Pedestrian Detection, Traffic Sign Recognition, Drive Recording, Automatic Emergency Braking, Adaptive Cruise Control, Forward Collision Warning, Parking Assist and more.

https://www.mistralsolutions.com/product-engineering-services/expertise/development-platforms/sensor-fusion-kit/

 

9. Thermal expert, TE-EQ1, TE-EV1 | TE-EQ2, TE-EV2, TE-EX2

TE-EQ1	TE-EV1
TE-EQ1	TE-EV1	TE-EQ2	TE-EV2	TE-EX2

TE Engine (12㎛) is compact, light weight Thermal Camera.
Various output interfaces are selectable to meet own application.
Based on uncooled 12㎛ detector, XGA (1024x768), VGA (640x480), and QVGA (384x288) resolutions are available up to 30Hz (60Hz).

Compared to TE Engine (17㎛), the size has reduced approximately 60%, but shows equal performance.

 

 

10. Overview and Comparison

Camera Model	Processor	Resolution	Functions
FLIR, BOSON	Intel Movidius Myriad 2	VOx 640x512, 12um	Silent Shutterless NUC (SSN), FFC update
FLIR, Firefly	Intel Movidius Myriad 2	CMOS 1440x1080,	Gamma, lookup table, denoise, and sharpness
Huaray, Smart camera	Intel Movidius  Myriad 2	Mono 5472x3648	0.5M/1.3M/2.3M/5.3M/6.3M/12M/20M Pattern matching/OCR/ Measurement
ADLINKL, NEON-i2000	Intel Movidius  Myriad 2 Intel Atom x5-E3930 CPU	2.0 MP / 30 fps (NEON-i203B). 5.0 MP / 14 fps (NEON-i204B).	Multiple deep learning processors, user can deploy the AI camera system with different neural network created by OpenVINO.
OpenNCC, night	Intel Movidius  Myriad x MV2085	CCD Full HD	ONNX, caffe, tensorflow, MXNet, Kaldi
MISTRAL, Sensor Fusion Kit	Ti TDA3 SoC AWR1443	1.3M CMOS HD	Applications for Object Detection, Lane Tracking, Lane Detection and Departure Warning, Pedestrian Detection
Thermal expert, TE-Ex series	Ti TDA3 SoC	384x288 to 1024x768, 12㎛	Digital: Camera Link, USB, LVDS, LVCMOS, BT656 Analog : NTSC, PAL

*OpenVINO, DevCloud https://devcloud.intel.com/edge/get_started/openvino/

*Movidius Gen3(Keem bay), http://www.istyatech.com/journal/viewtopic.php?73cc83=movidius-keem-bay

 

 

11. Comparison of Processors

Maker	Processor (group)	Processor	Dev. enviroment	AI supports
Ti	TDAx	TDA3 (Jacinto 6)	CCS v7	ADAS automatic parking, object detection, land detection, free space detection
	TDAx	TDA4 (Jacinto 7)	CCS v7
Intel (SoC)	Movidius Gen2	Myriad	Windows,  OpenVINO*	OpenVINO™ toolkit for porting neural network Rapidly port and deploy neural networks in Caffe and Tensorflow formats
	Movidius Gen3	Keem bay	Windows,  OpenVINO*	approx. x10 of Myriad x4 of Xavier

https://www.phoronix.com/scan.php?page=news_item&px=Intel-KMB-DRM-Driver.